74ABT02DB-T
vs
74ABT02DB,112
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SSOP2
|
SSOP2
|
| Package Description |
SSOP, SSOP14,.3
|
SSOP, SSOP14,.3
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ABT
|
ABT
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e4
|
| Length |
6.2 mm
|
6.2 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
NOR GATE
|
NOR GATE
|
| Max I(ol) |
0.02 A
|
0.02 A
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Equivalence Code |
SSOP14,.3
|
SSOP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Packing Method |
TR
|
TUBE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Power Supply Current-Max (ICC) |
0.05 mA
|
0.05 mA
|
| Prop. Delay@Nom-Sup |
4.4 ns
|
4.4 ns
|
| Propagation Delay (tpd) |
3.4 ns
|
3.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
2 mm
|
2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
5.3 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare 74ABT02DB-T with alternatives
Compare 74ABT02DB,112 with alternatives