74ABT16244ADGG,118
vs
74ABT16245ADGVRE4
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
|
| Package Description |
6.10 MM, PLASTIC, MO-153, SOT362-1, TSSOP-48
|
TSSOP,
|
| Pin Count |
48
|
|
| Manufacturer Package Code |
SOT362-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
ABT
|
ABT
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| JESD-609 Code |
e4
|
|
| Length |
12.5 mm
|
9.7 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS TRANSCEIVER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
8
|
| Number of Functions |
4
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
3.4 ns
|
4.2 ns
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6.1 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
WITH DIRECTION CONTROL
|
|
|
|
Compare 74ABT16244ADGG,118 with alternatives
Compare 74ABT16245ADGVRE4 with alternatives