74ABT16373CMTD vs 74ABT16373BDGG,118 feature comparison

74ABT16373CMTD National Semiconductor Corporation

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74ABT16373BDGG,118 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NXP SEMICONDUCTORS
Package Description PLASTIC, TSSOP-48 TSSOP, TSSOP48,.3,20
Reach Compliance Code compliant unknown
Family ABT ABT
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0
Length 12.5 mm 12.5 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 2
Number of Bits 8 8
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 48 48
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP48,.3,20 TSSOP48,.3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Power Supply Current-Max (ICC) 62 mA
Prop. Delay@Nom-Sup 5.6 ns 4.4 ns
Propagation Delay (tpd) 5.5 ns 4.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 6.1 mm 6.1 mm
Base Number Matches 4 1
Part Package Code TSSOP
Pin Count 48
Manufacturer Package Code SOT362-1
HTS Code 8542.39.00.01
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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