74AC11074N vs HD74HC174P feature comparison

74AC11074N NXP Semiconductors

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HD74HC174P Renesas Electronics Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Qualification Status Not Qualified Not Qualified
Base Number Matches 4 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Package Description DIP, DIP16,.3
Pin Count 16
Family HC/UH
JESD-30 Code R-PDIP-T16
Length 19.2 mm
Load Capacitance (CL) 50 pF
Max Frequency@Nom-Sup 24000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 6
Number of Functions 1
Number of Terminals 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 200 ns
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Trigger Type POSITIVE EDGE
Width 7.62 mm

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