74AC32MTCX vs TC74VHC32FN(ELP) feature comparison

74AC32MTCX National Semiconductor Corporation

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TC74VHC32FN(ELP) Toshiba America Electronic Components

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TOSHIBA CORP
Package Description PLASTIC, TSSOP-14 SOP, SOP14,.25
Reach Compliance Code unknown unknown
Family AC AHC/VHC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 8.65 mm
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 9 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 3.9 mm
Base Number Matches 5 1
Pbfree Code No
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
HTS Code 8542.39.00.01
Samacsys Manufacturer Toshiba
Load Capacitance (CL) 50 pF
Max I(ol) 0.008 A
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 8.5 ns
Schmitt Trigger NO
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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