74AC32PWDH-T vs 74AHC32PW,118 feature comparison

74AC32PWDH-T NXP Semiconductors

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74AHC32PW,118 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AC AHC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 6 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
Rohs Code Yes
Part Package Code TSSOP
Pin Count 14
Manufacturer Package Code SOT402-1
Factory Lead Time 4 Weeks
JESD-609 Code e4
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 9.5 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare 74AC32PWDH-T with alternatives

Compare 74AHC32PW,118 with alternatives