Findchips: Compare 74AHC132BQ vs 74AHC132BQ,115

74AHC132BQ vs 74AHC132BQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	NXP SEMICONDUCTORS	NEXPERIA
Part Package Code	QFN	QFN
Package Description	HVQCCN,	HVQCCN,
Pin Count	14	14
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	AHC/VHC/H/U/V	AHC/VHC/H/U/V
JESD-30 Code	R-PQCC-N14	R-PQCC-N14
Length	3 mm	3 mm
Logic IC Type	NAND GATE	NAND GATE
Moisture Sensitivity Level	1	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	HVQCCN
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	19.5 ns	19.5 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1 mm	1 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	QUAD	QUAD
Time@Peak Reflow Temperature-Max (s)	30	30
Width	2.5 mm	2.5 mm
Base Number Matches	5	1
Manufacturer Package Code		SOT762-1
Factory Lead Time		6 Weeks
Samacsys Manufacturer		Nexperia
JESD-609 Code		e4
Packing Method		TR, 7 INCH
Terminal Finish		NICKEL PALLADIUM GOLD
	Logic » Gates	Logic » Gates