Findchips: Compare 74AHC132BQ vs 74LVC132ABQ,115

74AHC132BQ vs 74LVC132ABQ,115 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	NEXPERIA	NXP SEMICONDUCTORS
Package Description	HVQCCN,	HVQCCN, LCC14,.1X.12,20
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Date Of Intro	1999-05-31
Family	AHC/VHC/H/U/V	LVC/LCX/Z
JESD-30 Code	R-PQCC-N14	R-PQCC-N14
JESD-609 Code	e4	e4
Length	3 mm	3 mm
Logic IC Type	NAND GATE	NAND GATE
Moisture Sensitivity Level	1	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	HVQCCN	HVQCCN
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)	260	260
Propagation Delay (tpd)	19.5 ns	16 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1 mm	1 mm
Supply Voltage-Max (Vsup)	5.5 V	3.6 V
Supply Voltage-Min (Vsup)	2 V	1.2 V
Supply Voltage-Nom (Vsup)	5 V	1.8 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	NO LEAD	NO LEAD
Terminal Pitch	0.5 mm	0.5 mm
Terminal Position	QUAD	QUAD
Time@Peak Reflow Temperature-Max (s)	30	30
Width	2.5 mm	2.5 mm
Base Number Matches	3	2
Part Package Code		QFN
Pin Count		14
Manufacturer Package Code		SOT762-1
Max I(ol)		0.024 A
Package Equivalence Code		LCC14,.1X.12,20
Packing Method		TR
Prop. Delay@Nom-Sup		8 ns
Schmitt Trigger		YES
	Logic » Gates	Logic » Gates