74AHC138D,112
vs
74LCX138SJ
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
SOP
|
SOP
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
|
5.30 MM, EIAJ TYPE2, SOP-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT109-1
|
16LD,SOP,EIAJ TYPE II, 5.3MM WIDE
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
1999-09-27
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
AHC/VHC/H/U/V
|
LVC/LCX/Z
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
9.9 mm
|
10.2 mm
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
20 ns
|
7.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
5.3 mm
|
| Base Number Matches |
2
|
5
|
| Pbfree Code |
|
Yes
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.024 A
|
| Package Equivalence Code |
|
SOP16,.3
|
| Packing Method |
|
RAIL
|
| Prop. Delay@Nom-Sup |
|
6 ns
|
|
|
|
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