74AHC138PW-Q100J
vs
74LVC138APW-Q100J
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
|
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT403-1
|
SOT403-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| Family |
AHC/VHC/H/U/V
|
LVC/LCX/Z
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
5 mm
|
5 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Max I(ol) |
0.008 A
|
0.024 A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
TR
|
| Prop. Delay@Nom-Sup |
13 ns
|
7.5 ns
|
| Propagation Delay (tpd) |
20 ns
|
12.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|