74AHC244BQ,115 vs TC74LCX244FWELP feature comparison

74AHC244BQ,115 NXP Semiconductors

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TC74LCX244FWELP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code QFN SOIC
Package Description HVQCCN, LCC20,.1X.18,20 0.300 INCH, PLASTIC, SOP-20
Pin Count 20 20
Manufacturer Package Code SOT764-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Control Type ENABLE LOW
Family AHC/VHC/H/U/V LVC/LCX/Z
JESD-30 Code R-PQCC-N20 R-PDSO-G20
JESD-609 Code e4
Length 4.5 mm 12.8 mm
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.008 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Equivalence Code LCC20,.1X.18,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 9.5 ns
Propagation Delay (tpd) 15 ns 6.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 2.7 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 2.5 mm 7.5 mm
Base Number Matches 2 1
Pbfree Code No
Load Capacitance (CL) 50 pF

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