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74AHC32BQ,115 vs 74LVC38ABQ,115 feature comparison

74AHC32BQ,115 Nexperia

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74LVC38ABQ,115 NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description HVQCCN, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14
Pin Count 14 14
Manufacturer Package Code SOT762-1 SOT762-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family AHC/VHC/H/U/V LVC/LCX/Z
JESD-30 Code R-PQCC-N14 R-PQCC-N14
JESD-609 Code e4 e4
Length 3 mm 3 mm
Logic IC Type OR GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR, 7 INCH TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 14.5 ns 5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.2 V
Supply Voltage-Nom (Vsup) 5 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2.5 mm 2.5 mm
Base Number Matches 1 1
Rohs Code Yes
Max I(ol) 0.024 A
Output Characteristics OPEN-DRAIN
Package Equivalence Code LCC14,.1X.12,20
Prop. Delay@Nom-Sup 4.5 ns
Schmitt Trigger NO
Logic » Gates
Logic » Gates

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