74AHC32D,118
vs
HD74LV32AFP-E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14
|
SOP,
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
SOT108-1
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
6 Weeks
|
|
| Date Of Intro |
1998-12-10
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Family |
AHC
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e6
|
| Length |
8.65 mm
|
10.06 mm
|
| Logic IC Type |
OR GATE
|
OR GATE
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Packing Method |
TR, 13 INCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
14.5 ns
|
19 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN BISMUTH
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
5.5 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
|
|
|
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Compare HD74LV32AFP-E with alternatives