74AHC32PWDH vs MC74AC32MELG feature comparison

74AHC32PWDH NXP Semiconductors

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MC74AC32MELG Rochester Electronics LLC

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code TSSOP SOIC
Package Description TSSOP, LEAD FREE, EIAJ, SO-14
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family AHC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 5 mm 10.2 mm
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 13 ns 10 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.1 mm 2.05 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.275 mm
Base Number Matches 1 2
Pbfree Code Yes
Moisture Sensitivity Level NOT SPECIFIED
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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