74AHC32PWDH vs TC74AC32F(ELP) feature comparison

74AHC32PWDH NXP Semiconductors

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TC74AC32F(ELP) Toshiba America Electronic Components

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Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description TSSOP, SOP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC AC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 5 mm 10.3 mm
Logic IC Type OR GATE OR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Propagation Delay (tpd) 13 ns 8.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.3 mm
Base Number Matches 1 1
Additional Feature 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME
Load Capacitance (CL) 50 pF

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Compare TC74AC32F(ELP) with alternatives