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74AHCT139PW,118 vs 74AHCT139D feature comparison

74AHCT139PW,118 NXP Semiconductors

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74AHCT139D Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, SOT-403-1, TSSOP-16 DIP, DIP16,.3
Pin Count 16
Manufacturer Package Code SOT403-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AHCT/VHCT AHCT/VHCT/VT
JESD-30 Code R-PDSO-G16 R-XDIP-T16
JESD-609 Code e4 e0
Length 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type 2-LINE TO 4-LINE DECODER 2-LINE TO 4-LINE DECODER
Max I(ol) 0.008 A 0.024 A
Moisture Sensitivity Level 1
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY CERAMIC
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 11.5 ns
Propagation Delay (tpd) 11.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm
Base Number Matches 2 5
ECCN Code EAR99
Input Conditioning STANDARD
Logic » Decoder/Drivers
Logic » Decoder/Drivers

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