74AHCT1G07GW,115 vs TC7SET34FU,LJ(CT feature comparison

74AHCT1G07GW,115 NXP Semiconductors

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TC7SET34FU,LJ(CT Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP
Package Description 1.25 MM, PLASTIC, MO-203, SOT-353-1, SC-88A, TSSOP-5 TSSOP,
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code unknown unknown
Family AHCT/VHCT/VT AHCT/VHCT/VT
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Length 2.05 mm 2 mm
Logic IC Type BUFFER BUFFER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 9 ns 12 ns
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 1 1
HTS Code 8542.39.00.01
Samacsys Manufacturer Toshiba
Additional Feature SEATED HT-CALCULATED
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74AHCT1G07GW,115 with alternatives

Compare TC7SET34FU,LJ(CT with alternatives