74AHCT1G08GW-G vs 74HCT1G08GW-G feature comparison

74AHCT1G08GW-G NXP Semiconductors

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74HCT1G08GW-G NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOT SOIC
Package Description TSSOP, PLASTIC, SC-88A, 5 PIN
Pin Count 5 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2.05 mm 2 mm
Logic IC Type AND GATE AND GATE
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 10.5 ns 27 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.002 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

Compare 74AHCT1G08GW-G with alternatives

Compare 74HCT1G08GW-G with alternatives