74AUP1G07SE-7
vs
74AUP1G17SE-7
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
DIODES INC
|
DIODES INC
|
Part Package Code |
SOT-353
|
SOT-353
|
Package Description |
GREEN, SOT-353, 5 PIN
|
TSSOP,
|
Pin Count |
5
|
5
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
8 Weeks
|
Samacsys Manufacturer |
Diodes Incorporated
|
Diodes Incorporated
|
Family |
AUP/ULP/V
|
AUP/ULP/V
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e3
|
Length |
2.15 mm
|
2.15 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP5/6,.08
|
TSSOP5/6,.08
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
20.7 ns
|
20.1 ns
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.3 mm
|
1.3 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare 74AUP1G07SE-7 with alternatives
Compare 74AUP1G17SE-7 with alternatives