74AUP1G09GW,125 vs SN74AUP1G08DCK feature comparison

74AUP1G09GW,125 NXP Semiconductors

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SN74AUP1G08DCK Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP
Package Description 1.25 MM, PLASTIC, MO-203, SOT353-1, SC-88A, TSSOP-5 TSSOP, TSSOP5/6,.08
Pin Count 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant unknown
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3
Length 2.05 mm 2 mm
Load Capacitance (CL) 30 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 24 ns
Propagation Delay (tpd) 24 ns 25.5 ns
Qualification Status Not Qualified
Schmitt Trigger YES
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01

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