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74AUP1G125GM-H vs 74AUP1G125GM,132 feature comparison

74AUP1G125GM-H NXP Semiconductors

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74AUP1G125GM,132 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SON SON
Package Description VSON, 1 X 1.45 MM, 0.5 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count 6 6
Reach Compliance Code unknown compliant
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-N6
Length 1.45 mm 1.45 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 1 mm 1 mm
Base Number Matches 1 2
Rohs Code Yes
Manufacturer Package Code SOT886
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
JESD-609 Code e3
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Package Equivalence Code SOLCC6,.04,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 24 ns
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

Compare 74AUP1G125GM-H with alternatives

Compare 74AUP1G125GM,132 with alternatives