74AUP1G125GW,125 vs 74AUP1G126GM,132 feature comparison

74AUP1G125GW,125 Nexperia

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74AUP1G126GM,132 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code TSSOP SON
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5 VSON, SOLCC6,.04,20
Pin Count 5 6
Manufacturer Package Code SOT353-1 SOT886
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-N6
JESD-609 Code e3 e3
Length 2.05 mm 1.45 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 5 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR, 7 INCH TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1 mm
Base Number Matches 1 1
Control Type ENABLE HIGH
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code SOLCC6,.04,20
Prop. Delay@Nom-Sup 24 ns

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Compare 74AUP1G126GM,132 with alternatives