74AUP1G126GM-H vs 74AUP1G125DBVRG4 feature comparison

74AUP1G126GM-H NXP Semiconductors

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74AUP1G125DBVRG4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code SON SOT-23
Package Description VSON, LSSOP, TSOP5/6,.11,37
Pin Count 6 5
Reach Compliance Code unknown compliant
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G5
Length 1.45 mm 2.9 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON LSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Propagation Delay (tpd) 24 ns 21.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.45 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.8 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.95 mm
Terminal Position DUAL DUAL
Width 1 mm 1.6 mm
Base Number Matches 1 1
Rohs Code Yes
HTS Code 8542.39.00.01
Control Type ENABLE LOW
JESD-609 Code e4
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Package Equivalence Code TSOP5/6,.11,37
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 21.4 ns
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare 74AUP1G126GM-H with alternatives

Compare 74AUP1G125DBVRG4 with alternatives