74AUP1G126GW
vs
SN74AUC1G125YZAR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Control Type |
ENABLE HIGH
|
ENABLE LOW
|
| JESD-30 Code |
R-PDSO-G5
|
R-XBGA-B5
|
| JESD-609 Code |
e0
|
|
| Load Capacitance (CL) |
30 pF
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Max I(ol) |
0.0017 A
|
0.005 A
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Equivalence Code |
TSSOP5/6,.08
|
BGA5,2X3,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR
|
TR
|
| Prop. Delay@Nom-Sup |
24 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DSBGA
|
| Package Description |
|
GREEN, MO-211EA, DSBGA-5
|
| Pin Count |
|
5
|
| Family |
|
AUC
|
| Length |
|
1.4 mm
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
|
3.6 ns
|
| Seated Height-Max |
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
|
1.2 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
0.9 mm
|
|
|
|
Compare SN74AUC1G125YZAR with alternatives