74AUP1G126GW
vs
SN74AUC1G126YZAR
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Control Type |
ENABLE HIGH
|
ENABLE HIGH
|
JESD-30 Code |
R-PDSO-G5
|
R-PBGA-B5
|
JESD-609 Code |
e0
|
|
Load Capacitance (CL) |
30 pF
|
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Max I(ol) |
0.0017 A
|
0.005 A
|
Number of Bits |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP5/6,.08
|
BGA5,2X3,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Packing Method |
TR
|
TR
|
Prop. Delay@Nom-Sup |
24 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.635 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
BGA
|
Package Description |
|
VFBGA, BGA5,2X3,20
|
Pin Count |
|
5
|
Family |
|
AUC
|
Length |
|
1.4 mm
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Propagation Delay (tpd) |
|
3.6 ns
|
Seated Height-Max |
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
|
2.7 V
|
Supply Voltage-Min (Vsup) |
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
|
1.2 V
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Width |
|
0.9 mm
|
|
|
|
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