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74AUP1G157GW,125 vs 74AUP2G157DC,125 feature comparison

74AUP1G157GW,125 NXP Semiconductors

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74AUP2G157DC,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP SSOP
Package Description PLASTIC, SOT-363, SC-88, SMD-6 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Pin Count 6 8
Manufacturer Package Code SOT363 SOT765-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G6 R-PDSO-G8
JESD-609 Code e3 e4
Length 2 mm 2.3 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSSOP
Package Equivalence Code TSSOP6,.08 TSSOP8,.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 21.9 ns 22.8 ns
Propagation Delay (tpd) 21.9 ns 22.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 2 mm
Base Number Matches 2 2
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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