74AUP1G158GM,115 vs 74AUP1G158GF feature comparison

74AUP1G158GM,115 Nexperia

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74AUP1G158GF NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code SON SON
Package Description XSON-6 1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
Pin Count 6 6
Manufacturer Package Code SOT886
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 6 Weeks
Samacsys Manufacturer Nexperia
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 S-PDSO-N6
JESD-609 Code e4 e3
Length 1.45 mm 1 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR, 7 INCH TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 21 ns 21 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.35 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1 mm
Base Number Matches 2 2
Pbfree Code Yes
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code SOLCC6,.04,14
Prop. Delay@Nom-Sup 21 ns

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