74AUP1G17FW4-7
vs
TC7SG07FE
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
DIODES INC
|
TOSHIBA CORP
|
| Part Package Code |
DFN
|
SON
|
| Package Description |
VSON,
|
VSOF,
|
| Pin Count |
6
|
5
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
24 Weeks
|
|
| Samacsys Manufacturer |
Diodes Incorporated
|
|
| Family |
AUP/ULP/V
|
LVP
|
| JESD-30 Code |
S-PDSO-N6
|
R-PDSO-F5
|
| JESD-609 Code |
e4
|
|
| Length |
1 mm
|
1.6 mm
|
| Logic IC Type |
BUFFER
|
BUFFER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
VSOF
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
20.1 ns
|
26.7 ns
|
| Seated Height-Max |
0.4 mm
|
0.6 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.9 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
FLAT
|
| Terminal Pitch |
0.35 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1 mm
|
1.2 mm
|
| Base Number Matches |
1
|
1
|
| Output Characteristics |
|
OPEN-DRAIN
|
|
|
|
Compare 74AUP1G17FW4-7 with alternatives
Compare TC7SG07FE with alternatives