74AUP1G17GW,125 vs SN74AUP1G34YEPR feature comparison

74AUP1G17GW,125 NXP Semiconductors

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SN74AUP1G34YEPR Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP BGA
Package Description 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5 VFBGA, BGA5,2X3,20
Pin Count 5 5
Manufacturer Package Code SOT353-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-XBGA-B5
JESD-609 Code e3
Length 2.05 mm 1.4 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP5/6,.08 BGA5,2X3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 20.1 ns 18.9 ns
Propagation Delay (tpd) 20.1 ns 18.9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger YES NO
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 0.9 mm
Base Number Matches 2 1
Output Characteristics 3-STATE

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