74AUP1G34GW-Q100 vs 74AUP1G17GW feature comparison

74AUP1G34GW-Q100 Nexperia

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74AUP1G17GW NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, 1.25 MM, PLASTIC, MO-203, SC-88A, SOT353-1, TSSOP-5
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5,.08 TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.0014 mA
Propagation Delay (tpd) 20.8 ns 20.1 ns
Schmitt Trigger YES YES
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 3
Pbfree Code Yes
Part Package Code TSSOT
Pin Count 5
Packing Method TR
Prop. Delay@Nom-Sup 20.1 ns
Qualification Status Not Qualified

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