74AUP1G373GW,125 vs SN74AUC1G74YZTR feature comparison

74AUP1G373GW,125 NXP Semiconductors

Buy Now Datasheet

SN74AUC1G74YZTR Texas Instruments

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TEXAS INSTRUMENTS INC
Part Package Code TSSOP BGA
Package Description PLASTIC, SOT363, SC-88, 6 PIN LAED FREE, DSBGA-8
Pin Count 6 8
Manufacturer Package Code SOT363
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AUP/ULP/V AUC
JESD-30 Code R-PDSO-G6 R-XBGA-B8
JESD-609 Code e3
Length 2 mm 1.9 mm
Load Capacitance (CL) 30 pF 15 pF
Logic IC Type D LATCH D FLIP-FLOP
Max I(ol) 0.0017 A 0.005 A
Moisture Sensitivity Level 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 6 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code TSSOP VFBGA
Package Equivalence Code TSSOP6,.08 BGA8,2X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 25.6 ns 3.8 ns
Propagation Delay (tpd) 25.9 ns 3.8 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.63 mm
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 1.25 mm 0.9 mm
Base Number Matches 2 1
Max Frequency@Nom-Sup 200000000 Hz
Packing Method TR
fmax-Min 275 MHz

Compare 74AUP1G373GW,125 with alternatives

Compare SN74AUC1G74YZTR with alternatives