74AUP1G885GM,125 vs 74AHC3G04DP feature comparison

74AUP1G885GM,125 NXP Semiconductors

Buy Now Datasheet

74AHC3G04DP Nexperia

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code QFN
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, MO-255, SOT902-1, QFN-8 3 MM, PLASTIC, SOT505-2, TSSOP-8
Pin Count 8
Manufacturer Package Code SOT902-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family AUP/ULP/V AHC/VHC/H/U/V
JESD-30 Code S-PQCC-N8 S-PDSO-G8
JESD-609 Code e4 e4
Length 1.6 mm 3 mm
Load Capacitance (CL) 30 pF
Logic IC Type XOR GATE INVERTER
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 3
Number of Inputs 3 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN TSSOP
Package Equivalence Code LCC8,.06SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 23.7 ns
Propagation Delay (tpd) 23.7 ns 14.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 2 V
Supply Voltage-Nom (Vsup) 1.1 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD SILVER
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 3 mm
Base Number Matches 2 3

Compare 74AUP1G885GM,125 with alternatives

Compare 74AHC3G04DP with alternatives