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74AUP1G885GM,125 vs 74AUP2G00GD,125 feature comparison

74AUP1G885GM,125 NXP Semiconductors

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74AUP2G00GD,125 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN SON
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, MO-255, SOT902-1, QFN-8 3 X 2 MM, 0.50 MM HEIGHT, PLASTIC, SOT996-2, XSON-8
Pin Count 8 8
Manufacturer Package Code SOT902-2 SOT996-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 4 Weeks
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PQCC-N8 R-PDSO-N8
JESD-609 Code e4 e4
Length 1.6 mm 3 mm
Load Capacitance (CL) 30 pF 30 pF
Logic IC Type XOR GATE NAND GATE
Max I(ol) 0.0017 A 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 3 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VSON
Package Equivalence Code LCC8,.06SQ,20 SOLCC8,.11,20
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 23.7 ns 24.9 ns
Propagation Delay (tpd) 23.7 ns 24.9 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 2 mm
Base Number Matches 2 2
Logic » Gates
Logic » Gates

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