74AUP1G885GM,125 vs NC7WZ08L8X feature comparison

74AUP1G885GM,125 NXP Semiconductors

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NC7WZ08L8X Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code QFN QFN
Package Description 1.60 X 1.60 MM, 0.50 MM HEIGHT, 0.50 MM PITCH, MO-255, SOT902-1, QFN-8 VQCCN,
Pin Count 8 8
Manufacturer Package Code SOT902-2
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family AUP/ULP/V LVC/LCX/Z
JESD-30 Code S-PQCC-N8 S-XQCC-N8
JESD-609 Code e4
Length 1.6 mm 1.6 mm
Load Capacitance (CL) 30 pF
Logic IC Type XOR GATE AND GATE
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 3 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code VQCCN VQCCN
Package Equivalence Code LCC8,.06SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 23.7 ns
Propagation Delay (tpd) 23.7 ns 11 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 0.5 mm 0.55 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 1.65 V
Supply Voltage-Nom (Vsup) 1.1 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NOT SPECIFIED
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 1.6 mm
Base Number Matches 2 3
Pbfree Code Yes

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