74AUP1Z125GM,115 vs 74AUP1Z125GW,125 feature comparison

74AUP1Z125GM,115 NXP Semiconductors

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74AUP1Z125GW,125 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SON TSSOP
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, ROHS COMPLIANT, MO-252, SOT-886, SON-6 PLASTIC, ROHS COMPLIANT, SOT-363, SC-88, 6 PIN
Pin Count 6 6
Manufacturer Package Code SOT886 SOT363-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 6 Weeks
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code R-PDSO-N6 R-PDSO-G6
JESD-609 Code e3 e3
Length 1.45 mm 2 mm
Logic IC Type BUS DRIVER BUS DRIVER
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 17.9 ns 17.9 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.5 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1 mm 1.25 mm
Base Number Matches 1 1
Samacsys Manufacturer Nexperia
Packing Method TR, 7 INCH

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Compare 74AUP1Z125GW,125 with alternatives