74AUP2G08GM vs 74AUP2G08GM,125 feature comparison

74AUP2G08GM NXP Semiconductors

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74AUP2G08GM,125 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code QFN QFN
Package Description 1.6 X 1.6 MM, 0.5 MM HEIGHT, MO-255, SOT902-1, QFN-8U 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PQCC-N8 S-PQCC-N8
JESD-609 Code e4 e4
Length 1.6 mm 1.6 mm
Load Capacitance (CL) 30 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VQCCN
Package Equivalence Code LCC8,.06SQ,20
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 24 ns
Propagation Delay (tpd) 24 ns 24 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.55 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 1.6 mm
Base Number Matches 3 1
Manufacturer Package Code SOT902-2
Samacsys Manufacturer Nexperia

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Compare 74AUP2G08GM,125 with alternatives