74AUP2G08GM vs 74AUP2G08GM,125 feature comparison

74AUP2G08GM Nexperia

Buy Now Datasheet

74AUP2G08GM,125 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description XQFN-8 1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-18
Family AUP/ULP/V AUP/ULP/V
JESD-30 Code S-PQCC-N8 S-PQCC-N8
JESD-609 Code e4 e4
Length 1.6 mm 1.6 mm
Logic IC Type AND GATE AND GATE
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VQCCN
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 24 ns 24 ns
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.8 V 0.8 V
Supply Voltage-Nom (Vsup) 1.1 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.6 mm 1.6 mm
Base Number Matches 2 1
Part Package Code QFN
Pin Count 8
Manufacturer Package Code SOT902-2
Factory Lead Time 4 Weeks
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code LCC8,.06SQ,20
Packing Method TR
Prop. Delay@Nom-Sup 24 ns
Qualification Status Not Qualified
Schmitt Trigger NO

Compare 74AUP2G08GM with alternatives