74AUP2G08GM
vs
74AUP2G08GM,125
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
NEXPERIA
|
| Package Description |
XQFN-8
|
1.60 X 1.60 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT902-1, QFN-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-02-18
|
|
| Family |
AUP/ULP/V
|
AUP/ULP/V
|
| JESD-30 Code |
S-PQCC-N8
|
S-PQCC-N8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
1.6 mm
|
1.6 mm
|
| Logic IC Type |
AND GATE
|
AND GATE
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
VQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
24 ns
|
24 ns
|
| Seated Height-Max |
0.5 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
0.8 V
|
0.8 V
|
| Supply Voltage-Nom (Vsup) |
1.1 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.6 mm
|
1.6 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
SOT902-2
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Nexperia
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74AUP2G08GM with alternatives
Compare 74AUP2G08GM,125 with alternatives