74CBTLV3125PW,118
vs
74CBTLV3126DS,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
SSOP1
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
|
3.90 MM, 0.635 MM PITCH, PLASTIC, SOT519-1, SSOP-16
|
| Pin Count |
14
|
16
|
| Manufacturer Package Code |
SOT402-1
|
SOT519-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| Family |
CBTLV/3B
|
CBTLV/3B
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G16
|
| Length |
5 mm
|
4.9 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
14
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Equivalence Code |
TSSOP14,.25
|
SSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Propagation Delay (tpd) |
0.31 ns
|
0.31 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.73 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
3.9 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
4 Weeks
|
|
|
|