74HC00D,652 vs MC74HC00ADDR2 feature comparison

74HC00D,652 NXP Semiconductors

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MC74HC00ADDR2 Motorola Semiconductor Products

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Source Content uid 74HC00D,652
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code SOIC
Package Description SOP, SOP14,.25 SOP,
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 22 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 2

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