74HC00D,653 vs MC74HC00ADR2 feature comparison

74HC00D,653 NXP Semiconductors

Buy Now Datasheet

MC74HC00ADR2 onsemi

Buy Now Datasheet
Source Content uid 74HC00D,653 MC74HC00ADR2
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Package Description SO-14 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TAPE AND REEL TR
Peak Reflow Temperature (Cel) 260 235
Power Supplies 2/6 V 2/6 V
Prop. Delay@Nom-Sup 27 ns 22 ns
Propagation Delay (tpd) 135 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL/PALLADIUM/GOLD (NI/PD/AU) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 5
Factory Lead Time 4 Weeks
JESD-609 Code e0

Compare 74HC00D,653 with alternatives

Compare MC74HC00ADR2 with alternatives