74HC00D/G,118 vs 74HC03DB feature comparison

74HC00D/G,118 NXP Semiconductors

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74HC03DB Nexperia

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Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SOIC
Package Description SOP, SOP14,.25 SSOP,
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method TR
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 145 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Width 3.9 mm 5.3 mm
Base Number Matches 2 2
Rohs Code Yes
HTS Code 8542.39.00.01
Date Of Intro 2017-02-01
Moisture Sensitivity Level 1
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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