74HC00D/G,118 vs GD74HC00J feature comparison

74HC00D/G,118 NXP Semiconductors

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GD74HC00J Goldstar Electron Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS GOLDSTAR ELECTRON CO LTD
Part Package Code SOIC
Package Description SOP, SOP14,.25 ,
Pin Count 14
Manufacturer Package Code SOT108-1
Reach Compliance Code unknown unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-CDIP-T14
JESD-609 Code e4
Length 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 23 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm
Base Number Matches 2 2

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