74HC00D-Q100,118 vs 5962-8984501CA feature comparison

74HC00D-Q100,118 NXP Semiconductors

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5962-8984501CA Intersil Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code SOIC DIP
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 DIP,
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 4850.05
CO2e (mg) 2675.92 60140.616
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 8.65 mm 19.56 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 50 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Screening Level AEC-Q100 MIL-STD-883
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 3.9 mm 7.62 mm
Base Number Matches 2 3
HTS Code 8542.39.00.01
JESD-609 Code e0
Terminal Finish TIN LEAD

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