74HC00D-Q100,118 vs 74HC00DB,112 feature comparison

74HC00D-Q100,118 Nexperia

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74HC00DB,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code SOIC SSOP1
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Pin Count 14 14
Manufacturer Package Code SOT108-1 SOT337-1
Reach Compliance Code compliant compliant
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 149.35
CO2e (mg) 2675.92 1851.94
Samacsys Manufacturer Nexperia
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 8.65 mm 6.2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method TR, 13 INCH TUBE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 135 ns 135 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD SILVER Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 5.3 mm
Base Number Matches 2 2
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SSOP14,.3
Prop. Delay@Nom-Sup 27 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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