74HC00D-Q100,118 vs 74HC132DB feature comparison

74HC00D-Q100,118 NXP Semiconductors

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74HC132DB NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SSOP
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 SSOP, SSOP14,.3
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SSOP
Package Equivalence Code SOP14,.25 SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH
Packing Method TR TUBE
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27 ns 31 ns
Propagation Delay (tpd) 135 ns 38 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3.9 mm 5.3 mm
Base Number Matches 2 2
Pbfree Code Yes
HTS Code 8542.39.00.01
JESD-609 Code e4
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)

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