74HC00D-Q100,118 vs 74HCT00N,652 feature comparison

74HC00D-Q100,118 Nexperia

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74HCT00N,652 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Part Package Code SOIC DIP
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 0.300 INCH, PLASTIC, MO-001, SC501-14, SOT27-1, DIP-14
Pin Count 14 14
Manufacturer Package Code SOT108-1 SOT27-1
Reach Compliance Code compliant compliant
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 1630.6
CO2e (mg) 2675.92 20219.441
Samacsys Manufacturer Nexperia NXP
Family HC/UH HCT
JESD-30 Code R-PDSO-G14 R-PDIP-T14
JESD-609 Code e4 e4
Length 8.65 mm 19.025 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR, 13 INCH TUBE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 135 ns 29 ns
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 4.2 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD SILVER NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 29 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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