74HC00D-Q100,118 vs TC74HC132AFN-ELP feature comparison

74HC00D-Q100,118 NXP Semiconductors

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TC74HC132AFN-ELP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
kg CO2e/kg 12.4 12.4
Average Weight (mg) 215.8 151.15
CO2e (mg) 2675.92 1874.26
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns 28 ns
Propagation Delay (tpd) 135 ns 28 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Screening Level AEC-Q100
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code No
HTS Code 8542.39.00.01
JESD-609 Code e0
Terminal Finish TIN LEAD

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