74HC00DB,112 vs MC74HC132AN feature comparison

74HC00DB,112 NXP Semiconductors

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MC74HC132AN Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP1 DIP
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Pin Count 14 14
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH
JESD-30 Code R-PDSO-G14
JESD-609 Code e4
Length 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 2 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm
Base Number Matches 2 5
Pbfree Code No

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