Findchips: Compare 74HC00DB,112 vs MM54HC00J

74HC00DB,112 vs MM54HC00J feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NEXPERIA	NATIONAL SEMICONDUCTOR CORP
Part Package Code	SSOP1	DIP
Package Description	SSOP-14	DIP, DIP14,.3
Pin Count	14	14
Manufacturer Package Code	SOT337-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Date Of Intro	2017-02-01
Samacsys Manufacturer	Nexperia
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-GDIP-T14
JESD-609 Code	e4	e0
Length	6.2 mm	19.43 mm
Logic IC Type	NAND GATE	NAND GATE
Moisture Sensitivity Level	1
Number of Functions	4	4
Number of Inputs	2	2
Number of Terminals	14	14
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
Package Code	SSOP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, SHRINK PITCH	IN-LINE
Peak Reflow Temperature (Cel)	260
Propagation Delay (tpd)	135 ns	27 ns
Seated Height-Max	2 mm	5.08 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	NO
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	MILITARY
Terminal Finish	NICKEL PALLADIUM GOLD	TIN LEAD
Terminal Form	GULL WING	THROUGH-HOLE
Terminal Pitch	0.65 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	5.3 mm	7.62 mm
Base Number Matches	2	4
Pbfree Code		No
Load Capacitance (CL)		50 pF
Max I(ol)		0.004 A
Package Equivalence Code		DIP14,.3
Prop. Delay@Nom-Sup		27 ns
Qualification Status		Not Qualified
Schmitt Trigger		NO
	Logic » Gates	Logic » Gates